LFP Texas Instruments Operational Amplifiers – Op Amps Op Amp datasheet, inventory, & pricing. LFP. The D packages are available taped and reeled. Add the suffix R to the device type (ie., LFDR). absolute maximum ratings over operating free-air. The LF can be used in applications such as high-speed integrators, .. Reproduction of TI information in TI data books or data sheets is permissible only if.
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LFP Datasheet, LFP PDF, Pinouts, Circuit – Texas Instruments
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It requires low supply current yet maintains a large gain-bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents. The LF can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits. Add the suffix R to the device type ie. Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.
Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Pulse techniques must be used that will maintain the junction temperatures as close to the ambient temperature as possible. Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously. Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Not recommended for new designs.
Device is in production to support existing customers, datasheeg TI does not recommend using this part in a new design. Device has been announced but is not in production. Samples may or may dqtasheet be available. TI has discontinued the production of the device. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. Important Information and Disclaimer: The information provided on this page represents TI’s knowledge and belief as of the date that it is provided.
TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but lr353p not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI’s liability arising out of such information exceed the total purchase price datashedt the TI part s at issue in this document sold by TI to Customer on an annual basis.
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not lf353; performed.
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